Summary Qualcomm secured a legal victory against Arm Holdings, with jurors finding no breach of a chip technology license tied to Qualcomm's $1.4 billion Nuvia acquisition. However, Arm plans to seek ...

TSMC's Wafer Manufacturing 2.0 Reshapes Advanced Packaging Market: Summary TSMC's "Wafer Manufacturing 2.0," launched in July 2024, integrates packaging, testing, and photomask pr ...

The semiconductor laser market is projected to grow from $3.1 billion in 2023 to more than $5 billion in 2029. Yole Group announces a 9% CAGR during this period. This growth ... Semiconductor ...

Global sales of total semiconductor manufacturing equipment by original equipment manufacturers (OEMs) are forecast to set a new industry record, reaching $113 billion ... Global semiconductor ...

This week, at the 2024 IEEE International Electron Devices Meeting (IEDM), imec presents a new CFET-based standard cell architecture containing two rows of CFETs with ... At an exclusive gathering in ...

Toray Engineering Co.,Ltd has developed the "TRENG-PLP Coater", a high-accuracy coating device for panel level packaging (PLP is an advanced semiconductor packaging ... Semiconductor Packaging News is ...

Semidynamics is happy to announce that UPMEM has selected Semidynamics as its core provider for its next generation of LPDDR5X Processing In Memory device. The standard ... Semiconductor Packaging ...

Aehr Test Systems announced that President and CEO Gayn Erickson will be participating in the 13th Annual NYC Summit investor conference being held Tuesday, December 17th ...

Sondrel has announced that it is now shipping finished chips to a US customer as part of a full turnkey contract of concept to silicon. The chips are accelerators for AI, which ... Semiconductor ...

TOPPAN Inc. has announces pard itticipation in US-JOINT1 from November 18. US-JOINT is a US-Japan consortium for next-generation semiconductor packaging established ... TOPPAN Inc. We search for ...

Ultrasonic die bonding revolutionizes semiconductor assembly with rapid processing, strong bonds, and low thermal stress. It excels in bonding dissimilar materials, advancing applications like power ...

Nikon Corporation (Nikon) has launched the NEXIV VMF-K Series, a next-generation video measuring system designed to meet the increasing semiconductor and electronic ... We search for industry news so ...