Semiconductor Packaging News12h
U.S. launches new probe into legacy Chinese chips as tech pressure on Beijing escalates
The Biden administration launched a Section 301 probe into Chinese legacy semiconductors, citing non-market practices that harm competition and create supply chain risks. The investigation may lead to ...
Semiconductor Packaging News11h
TSMC's Wafer Manufacturing 2.0 Reshapes Advanced Packaging Market
TSMC's Wafer Manufacturing 2.0 Reshapes Advanced Packaging Market: Summary TSMC's "Wafer Manufacturing 2.0," launched in July 2024, integrates packaging, testing, and photomask pr ...
Semiconductor Packaging News12h
Revolutionizing Memory: The Cutting-Edge Design Scheme Behind HBM3E's Success
The Cutting-Edge Design Scheme Behind HBM3E's Success: Summary SK hynix launched its HBM3E chip, pioneering a 6-phase RDQS scheme. This innovation enhances ...
Semiconductor Packaging News12h
Package Integrated Vapor Chamber Heat Spreaders
Advances in vapor chamber technology revolutionize thermal management, delivering up to 12.5°C cooler performance than copper spreaders. These integrated chambers now enhance efficiency in smartphones ...
Semiconductor Packaging News16h
Moore’s Law at 60: get the Intel on the next few decades
Summary Intel’s Sanjay Natarajan explores Moore’s Law’s transformative history, emphasizing its focus on cost reduction rather than just transistor doubling. He highlights its role in advancing global ...
Semiconductor Packaging News16h
US to probe China chips, setting up Trump for tariffs
Summary The Biden administration launched a probe into Chinese-made legacy semiconductors, citing national security risks and unfair subsidies. The investigation may lead to tariffs or import ...
Semiconductor Packaging News16h
Samsung inks deal for US CHIPS funds
Samsung Electronics and Texas Instruments finalized agreements for billions in US government funding under the CHIPS Act, boosting domestic semiconductor production. Samsung will receive $4.75 billion ...
Semiconductor Packaging News16h
WeEn Top Side Cooling SiC product introduction
SiC devices, including Schottky diodes and MOSFETs in TSPAK and TOLT packages. TSC reduces thermal resistance by 17%-19%, enhances performance, cuts costs, and minimizes EMI. Ideal for power-dense, ...
Semiconductor Packaging News5d
Veeco Elevates Next-Generation MicroLED Production with Lumina MOCVD System
Veeco Instruments Inc. announced that PlayNitride, an industry leader in MicroLED technology, has qualified Veeco's Lumina® MOCVD system for production ... Veeco Instruments Inc. We search for ...
Semiconductor Packaging News5d
New TPSMB Asymmetrical TVS Diodes from Littelfuse Provide Superior Gate Driver Protection
Littelfuse, Inc. announced the launch of its TPSMB Asymmetrical TVS Diode Series, the first-to-market asymmetrical transient voltage suppression (TVS) diode specifically ...
Semiconductor Packaging News5d
AI Technology Completes Strategic Acquisition of Ormet Circuits Inc.
AI Technology (AIT) is pleased to announce the successful completion of its acquisition of Ormet Circuits Inc. (Ormet) from EMD Electronics, the U.S. and Canada Electronics ... AI Technology, Inc.
Semiconductor Packaging News5d
Toughened, Non-Drip Epoxy Features High Glass Transition Temperature
Master Bond Supreme 121AOND is a toughened epoxy system for bonding and sealing applications. It is a two component, heat curing system with a thixotropic paste consistency. ... Developed for medical ...